Comparative evaluation of a new flying capacitor-based buck-boost converters for universal application
author                    
                    
                
statement of authorship                    
                    
Tala Hemmati Shahsavar
                            
                    
location of publication                    
                    
[Tallinn]
                            
                    
publisher                    
                    
                
year of publication                    
                    
                
pages                    
                    
p. 65-66 : ill
                            
                    
conference name, date                    
                    
21st International Symposium "Topical problems in the field of electrical and power engineering. Doctoral school of energy and geotechnology. III", June 15-18, 2022
                            
                    
conference location                    
                    
Pärnu, Estonia
                            
                    
ISBN                    
                    
978-9949-83-859-2
                            
                    
notes                    
                    
Bibliogr.: 5 ref
                            
                    
scientific publication                    
                    
teaduspublikatsioon
                            
                    
classifier                    
                    
                
TalTech department                    
                    
                
language                    
                    
inglise
                            
                    
                            Hemmati Shahsavar, T. Comparative evaluation of a new flying capacitor-based buck-boost converters for universal application // 21st International Symposium "Topical problems in the field of electrical and power engineering. Doctoral school of energy and geotechnology. III" : Pärnu, Estonia, June 15-18, 2022. [Tallinn] : Tallinn University of Technology, 2022. p. 65-66 : ill.