Comparison of individual SiC JBS chips and JBS stacks connected in series by diffusion welding
statement of authorship
N. Sleptšuk, O. Korolkov, J. Toompuu, T. Rang
location of publication
[Tallinn]
publisher
year of publication
pages
p. 81-84 : ill
conference name, date
12th Biennial Baltic Electronics Conference, 2010
conference location
Tallinn
subject term
ISSN
1736-3705
ISBN
978-1-4244-7357-1
notes
Bibliogr.: 5 ref
language
inglise
Sleptsuk, N., Korolkov, O., Toompuu, J., Rang, T. Comparison of individual SiC JBS chips and JBS stacks connected in series by diffusion welding // BEC 2010 : 2010 12th Biennial Baltic Electronics Conference : proceedings of the 12th Biennial Baltic Electronics Conference : Tallinn University of Technology, October 4-6, 2010, Tallinn, Estonia. [Tallinn] : Tallinn University of Technology, 2010. p. 81-84 : ill.