Thermally induced cracking in aluminum/boron carbide composite
                                            author
                                    
                                    
                                
                                            statement of authorship
                                    
                                    
Kimmari, E., Kommel, L
                                                    
                                            
                                            location of publication
                                    
                                    
Tallinn
                                                    
                                            
                                            publisher
                                    
                                    
                                
                                            year of publication
                                    
                                    
                                
                                            pages
                                    
                                    
p. 467-472 : ill
                                                    
                                            
                                            notes
                                    
                                    
Bibliogr.: 19 ref
                                                    
                                            
                                            language
                                    
                                    
inglise
                                                    
                                            
                            Kimmari, E., Kommel, L. Thermally induced cracking in aluminum/boron carbide composite // Proceedings of the 6th International Conference of DAAAM Baltic "Industrial Engineering" : 24-26th April 2008, Tallinn, Estonia. [2]. Tallinn : Tallinn University of Technology, 2008. p. 467-472 : ill.