Electrodeposition of adherent copper film on unmodified tungsten
author
Wang, Chen
Lei, Jipu
Bjelkevig, Cameron
Rudenja, Sergei
Magtoto, Noel
Kelber, Jeff
statement of authorship
Chen Wang, Jipu Lei, Cameron Bjelkevig, Sergei Rudenja, Noel Magtoto, Jeff Kelber
source
Thin solid films
journal volume number month
Vol. 445
year of publication
2003
pages
1, p. 72-79 : ill
url
https://www.sciencedirect.com/science/article/pii/S0040609003012392
subject term
elektrokeemia
vask
volfram
nukleatsioon
ISSN
0040-6090
notes
Bibliogr.: 28 ref
language
inglise