• Electrodeposition of adherent copper film on unmodified tungstenWang, Chen; Lei, Jipu; Bjelkevig, Cameron; Rudenja, Sergei; Magtoto, Noel; Kelber, JeffThin solid films2003 / 1, p. 72-79 : ill https://www.sciencedirect.com/science/article/pii/S0040609003012392