Multi-type dislocation substructure evolution in a high-strength and ductile duplex high-entropy nanocomposites

author
Mua, Yongkun
Shia, Jinqiang
Sun, Tongtong
Hua, Kai
Wang, Qing
statement of authorship
Yongkun Mua, Le Liu, Jinqiang Shia, Tongtong Sun, Kai Hua, Yuefei Jia, Kaikai Song, Yandong Jia, Qing Wang, Gang Wang
publisher
journal volume number month
vol. 247
year of publication
pages
art. 110322
keyword
duplex
high-entropy nanocomposites
nano-intermetallic precipitates
nanoscale solid-solution domains
multi-type dislocation substructure
ISSN
1359-8368
notes
Bibliogr.: 55 ref
scientific publication
teaduspublikatsioon
classifier
1.1
category (general)
kvartiil
Q1
language
inglise
Mua, Y., Liu, L., Shia, J., Sun, T., Hua, K., Jia, Y., Song, K., Jia, Y., Wang, Q., Wang, G. Multi-type dislocation substructure evolution in a high-strength and ductile duplex high-entropy nanocomposites // Composites Part B : Engineering (2022) vol. 247, art. 110322. https://doi.org/10.1016/j.compositesb.2022.110322