Encapsulated whiskers as electroconductive fillers for ceramics
statement of authorship
Irina Hussainova, Roman Ivanov, S. Sudhir Kale, Iwona Jasiuk
location of publication
Cham, Switzerland
publisher
year of publication
pages
p. 131-[139]
conference name, date
Colloquium 582: Short Fibre Reinforced Cementitious Composites and Ceramics, March 20-22, 2017
conference location
Tallinn, Estonia
ISSN
1869-8433
ISBN
978-3-030-00868-0
notes
Bibliogr.: 14 ref
TalTech department
language
inglise
Hussainova, I., Ivanov, R., Kale S.S., Jasiuk, I. Encapsulated whiskers as electroconductive fillers for ceramics // Short fibre reinforced cementitious composites and ceramics. Cham, Switzerland : Springer Nature, 2019. p. 131-[139]. (Advanced structured materials ; 95).