Tribological behavior at dry sliding by electric current of Cu-Cr-S alloy after equal channel angular pressing
author
Kommel, Lembit
statement of authorship
Lembit Kommel
source
Engineering materials and tribology XXV
location of publication
[S.l.]
publisher
Trans Tech Publications
year of publication
2017
pages
p. 430-435
series
Key engineering materials ; 721
conference name, date
25th International Baltic Conference of Engineering Materials and Tribology - BALTMATTRIB, November 3-4, 2016
conference location
Riga, Latvia
url
https://doi.org/10.4028/www.scientific.net/KEM.721.430
subject term
vasesulamid
kulumine (tehnika)
elektrijuhtivus
Scopus
https://www.scopus.com/sourceid/12378
https://www.scopus.com/record/display.uri?eid=2-s2.0-85009128726&origin=inward&txGid=f0c66b0723bb5795270128ebdd3b4af0
quartile
Q4
category (general)
Engineering
Tehnika
Materials science
Materjaliteadus
category (sub)
Engineering. Mechanical engineering
Tehnika. Masinaehitus
Engineering. Mechanics of materials
Tehnika. Materjalide mehaanika
Materials science. General materials science
Materjaliteadus. Üldine materjaliteadus
keyword
wear behavior
ultrafine-grained (UFG) microstructure
copper alloy
electrical conductivity
equal channel angular pressing (ECAP)
ISSN
1662-9795
1013-9826
ISBN
978-3-0357-1072-4
notes
Bibliogr.: 17 ref
scientific publication
teaduspublikatsioon
classifier
3.1
TalTech department
mehaanika ja tööstustehnika instituut
language
inglise