Comparison of individual SiC JBS chips and JBS stacks connected in series by diffusion welding

statement of authorship
N. Sleptšuk, O. Korolkov, J. Toompuu, T. Rang
location of publication
[Tallinn]
year of publication
pages
p. 81-84 : ill
conference name, date
12th Biennial Baltic Electronics Conference, 2010
conference location
Tallinn
ISSN
1736-3705
ISBN
978-1-4244-7357-1
notes
Bibliogr.: 5 ref
language
inglise