On model fitting methods for modeling polymer cure kinetics in microelectronics assembly applications

statement of authorship
T. Tilford, J. E. Morris, M. Ferenets, P. R. Rajaguru, S. K. Pavuluri, M. P. Y. Desmulliez and C. Bailey
source
3rd Electronic System-Integration Technology Conference (ESTC) : Berlin, 13-16 Sept. 2010 : proceedings
location of publication
[S.l.]
publisher
year of publication
pages
[6] p.: ill
conference name, date
3rd Electronic System-Integration Technology Conference (ESTC), 13-16 Sept. 2010
conference location
Berlin
ISBN
978-1-4244-8553-6
notes
Bibliogr.: 20 ref
language
inglise
Tilford, T., Morris, J.E., Ferenets, M., Rajaguru, P.R., Pavuluri, S.K., Desmulliez, M.P.Y., Bailey, C. On model fitting methods for modeling polymer cure kinetics in microelectronics assembly applications // 3rd Electronic System-Integration Technology Conference (ESTC) : Berlin, 13-16 Sept. 2010 : proceedings. [S.l.] : IEEE, 2010. [6] p.: ill.