Microstructure and microhardness characteristics in the interface region of Ti/TiAl-Nb diffusion bonding
author
Kommel, Lembit
statement of authorship
Lembit Kommel
source
Engineering Materials & Tribology : BALTMATTRIB - 2003 : 12th International Baltic Conference : October 2-3, 2003, Tallinn, Estonia : abstracts
location of publication
[Tallinn]
year of publication
2003
pages
p. 56
subject term
titaanisulamid
alumiiniumisulamid
mikrostruktuur
difusioon (füüsika)
uus tehnoloogia
ISBN
9985-59-383-9
language
inglise