Embedded electronics influence on the strength of carbon fiber laminate
author
Herranen, Henrik
Kers, Jaan
Preden, Jürgo-Sören
Talalaev, Robert
Eerme, Martin
Majak, Jüri
Lend, Henri
Allikas, Georg
statement of authorship
Hendrik Herranen, Jaan Kers, Jürgo S. Preden, Robert Talalaev, Martin Eerme, Jüri Majak, Henri Lend, Georg Allikas
source
Advances in applied materials and electronics engineering III
location of publication
[S.l.]
publisher
Trans Tech Publications
year of publication
2014
pages
p. 239-243
series
Advanced materials research ; 905
conference name, date
3rd International Conference on Applied Materials and Electronics Engineering, AMEE 2014, 26-27 April 2014
conference location
Hong Kong, China
url
https://doi.org/10.4028/www.scientific.net/AMR.905.239
subject term
komposiitmaterjalid
süsinikkiud
tugevus
Scopus
https://www.scopus.com/record/display.uri?eid=2-s2.0-84901723248&origin=inward&txGid=a841c3c6a076c4d71d0e4335b43b5b5c
quartile
Q4
keyword
composite
embedded electronics
CFRP
structural health monitoring
FEM analysis
ISSN
1022-6680
ISBN
978-3-03835-058-3
notes
Bibliogr.: 10 ref
scientific publication
teaduspublikatsioon
classifier
3.1
TalTech department
masinaehituse instituut
polümeermaterjalide instituut
materjalitehnika instituut
language
inglise