Micromechanical properties and electrical conductivity of Cu and Cu-0.7wt% Cr alloy
statement of authorship
Kommel, L., Pardis, N., Kimmari, E.
location of publication
Tallinn
publisher
year of publication
pages
p. 354-359 : ill
conference name, date
The 9th International Conference of DAAAM Baltic Industrial Engineering, 24-26th April 2014
conference location
Tallinn
subject term
keyword
ultrafine grained microstructure
electerical conductivity
Young modulus
ISSN
2346-612X
ISBN
978-9949-23-620-6
notes
Bibliogr.: 18 ref
TTÜ department
language
inglise
Kommel, L., Pardis, N., Kimmari, E. Micromechanical properties and electrical conductivity of Cu and Cu-0.7wt% Cr alloy // Proceedings of the 9th International Conference of DAAAM Baltic Industrial Engineering, 24-26th April 2014, Tallinn, Estonia. Tallinn : Tallinn University of Technology, 2014. p. 354-359 : ill.