Wang, C., Lei, J., Bjelkevig, C., Rudenja, S., Magtoto, N., Kelber, J.

Electrodeposition of adherent copper film on unmodified tungsten

author

Wang, Chen

Lei, Jipu

Bjelkevig, Cameron

Rudenja, Sergei

Magtoto, Noel

Kelber, Jeff

statement of authorship

Chen Wang, Jipu Lei, Cameron Bjelkevig, Sergei Rudenja, Noel Magtoto, Jeff Kelber

source

Thin solid films

journal volume number month

Vol. 445

year of publication

2003

pages

1, p. 72-79 : ill

url

https://www.sciencedirect.com/science/article/pii/S0040609003012392

subject term

elektrokeemia

vask

volfram

nukleatsioon

ISSN

0040-6090

notes

Bibliogr.: 28 ref

language

inglise

Wang, C., Lei, J., Bjelkevig, C., Rudenja, S., Magtoto, N., Kelber, J. Electrodeposition of adherent copper film on unmodified tungsten // Thin solid films (2003) Vol. 445, 1, p. 72-79 : ill. https://www.sciencedirect.com/science/article/pii/S0040609003012392