Electrodeposition of adherent copper film on unmodified tungsten

author
Wang, Chen
Lei, Jipu
Bjelkevig, Cameron
Kelber, Jeff
statement of authorship
Chen Wang, Jipu Lei, Cameron Bjelkevig, Sergei Rudenja, Noel Magtoto, Jeff Kelber
journal volume number month
Vol. 445
year of publication
pages
1, p. 72-79 : ill
ISSN
0040-6090
notes
Bibliogr.: 28 ref
language
inglise
Wang, C., Lei, J., Bjelkevig, C., Rudenja, S., Magtoto, N., Kelber, J. Electrodeposition of adherent copper film on unmodified tungsten // Thin solid films (2003) Vol. 445, 1, p. 72-79 : ill. https://www.sciencedirect.com/science/article/pii/S0040609003012392