• Embedded electronics influence on the strength of carbon fiber laminateHerranen, Henrik; Kers, Jaan; Preden, Jürgo-Sören; Talalaev, Robert; Eerme, Martin; Majak, Jüri; Lend, Henri; Allikas, GeorgAdvances in applied materials and electronics engineering III2014 / p. 239-243 https://doi.org/10.4028/www.scientific.net/AMR.905.239 https://www.scopus.com/record/display.uri?eid=2-s2.0-84901723248&origin=inward&txGid=a841c3c6a076c4d71d0e4335b43b5b5c
• Fatigue performance of semiconductor strain gauges in GFRP laminateHerranen, Henrik; Saar, Tõnis; Gordon, Rauno; Pohlak, Meelis; Lend, HenriAdvances in applied materials and electronics engineering III2014 / p. 244-248 https://doi.org/10.4028/www.scientific.net/AMR.905.244 https://www.scopus.com/record/display.uri?eid=2-s2.0-84901716598&origin=inward&txGid=88afa9ac5bad818d45daba18e44faad9
• Unmanned ground vehicle SysML navigation model conducted by energy efficiencyVäljaots, Eero; Sell, RaivoAdvances in applied materials and electronics engineering III2014 / p. 443-447 https://doi.org/10.4028/www.scientific.net/AMR.905.443 https://www.scopus.com/record/display.uri?eid=2-s2.0-84901713415&origin=inward&txGid=09c187cfd25b36579392a5c33328f8fd