Thermal behaviour of hydroxymethyl compounds as models for adhesive resins

statement of authorship
K.Siimer, P.Christjanson, T.Kaljuvee, T.Pehk, I.Saks
journal volume number month
Vol. 97
year of publication
pages
p. 459-466 : ill
ISSN
1388-6150
notes
Bibliogr.: 27 ref
language
inglise
Siimer, K., Christjanson, P., Kaljuvee, T., Pehk, T., Saks, I. Thermal behaviour of hydroxymethyl compounds as models for adhesive resins // Journal of thermal analysis and calorimetry (2009) Vol. 97, p. 459-466 : ill. https://link.springer.com/article/10.1007/s10973-009-0218-x