Seedless electrodeposition of Cu on unmodified tungsten

author
Wang, C.
statement of authorship
S.Rudenja, C.Wang
source
Electrochemical and solid state letters
journal volume number month
5
year of publication
pages
9, p. 27-30
language
inglise
Rudenja, S., Wang, C. Seedless electrodeposition of Cu on unmodified tungsten // Electrochemical and solid state letters (2002) 5, 9, p. 27-30. https://iopscience.iop.org/article/10.1149/1.1498015/pdf