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Electroless nickel plating model for plated-through-hole board manufacturing

author
Tenno, Robert
Kantola, K.
Tenno, Ander
statement of authorship
R.Tenno, K.Kantola and A.Tenno
source
Journal of electronic materials
journal volume number month
35
year of publication
2006
pages
10, p. 1825-1836 : ill
url
https://link.springer.com/content/pdf/10.1007/s11664-006-0164-3.pdf
subject term
nikkel
plaatimine
elektrokeemia
keemilised reaktsioonid
matemaatilised mudelid
ISSN
0361-5235
notes
Bibliogr.: 16 ref
language
inglise
Tenno, R., Kantola, K., Tenno, A. Electroless nickel plating model for plated-through-hole board manufacturing // Journal of electronic materials (2006) 35, 10, p. 1825-1836 : ill. https://link.springer.com/content/pdf/10.1007/s11664-006-0164-3.pdf