Effect of hard cyclic viscoplastic deformation on the microstructure, mechanical properties, and electrical conductivity of Cu-Cr alloy
author
Kommel, Lembit
Huot, Jacques
Omranpour Shahreza, Babak
statement of authorship
Lembit Kommel, Jacques Huot, Babak Omranpour Shahreza
source
Journal of Materials Engineering and Performance
publisher
Springer Nature
journal volume number month
vol. 31, 12
year of publication
2022
pages
p. 9690-9702
url
https://doi.org/10.1007/s11665-022-06997-w
subject term
vask
elektrijuhtivus
testimine
mikrostruktuur
keyword
copper
electron microscopy
electrical conductivity
hard cyclic viscoplastic deformation
mechanical testing
nanoindentation
ISSN
1059-9495
notes
Bibliogr.: 50 ref
scientific publication
teaduspublikatsioon
classifier
1.1
Scopus
https://www.scopus.com/sourceid/21160
https://www.scopus.com/record/display.uri?eid=2-s2.0-85130753747&origin=inward&txGid=dd61f66b348443be83828e8d678827e5
WOS
https://jcr.clarivate.com/jcr-jp/journal-profile?journal=J%20MATER%20ENG%20PERFORM&year=2022
https://www.webofscience.com/wos/woscc/full-record/WOS:000799086100001
category (general)
Engineering
Tehnika
Materials science
Materjaliteadus
category (sub)
Engineering. Mechanical engineering
Tehnika. Masinaehitus
Engineering. Mechanics of materials
Tehnika. Materjalide mehaanika
Materials science. General materials science
Materjaliteadus. Üldine materjaliteadus
quartile
Q2
TalTech department
mehaanika ja tööstustehnika instituut
language
inglise