List of Index: DOI
- https://doi.org/10.1109/TETC.2019.2910199 (1)
- https://doi.org/10.1109/TIA.2022.3193345 (1)
- https://doi.org/10.1109/TIA.2022.3208879 (1)
- https://doi.org/10.1109/TIE.2022.3215832 (1)
- https://doi.org/10.1109/TIE.2023.3250836 (1)
- https://doi.org/10.1109/TII.2021.3126111 (1)
- https://doi.org/10.1109/TMAG.2022.3164189 (1)
- https://doi.org/10.1109/TMAG.2022.3173663 (1)
- https://doi.org/10.1109/TNSE.2021.3052984 (1)
- https://doi.org/10.1109/TPEL.2021.3084918 (1)
- https://doi.org/10.1109/TPEL.2022.3170229 (1)
- https://doi.org/10.1109/TPEL.2022.3179784 (1)
- https://doi.org/10.1109/TPWRD.2021.3071023 (1)
- https://doi.org/10.1109/TPWRD.2022.3179836 (1)
- https://doi.org/10.1109/TPWRS.2022.3228458 (1)
- https://doi.org/10.1109/TSMC.2021.3123136 (1)
- https://doi.org/10.1109/TSP52935.2021.9522602 (1)
- https://doi.org/10.1109/TSP52935.2021.9522616 (1)
- https://doi.org/10.1109/TSP52935.2021.9522676 (1)
- https://doi.org/10.1109/TTE.2022.3189596 (1)
- https://doi.org/10.1109/WCNC55385.2023.10118649 (1)
- https://doi.org/10.1109/VLSI-SoC53125.2021.9606981 (1)
- https://doi.org/10.1109/WPW54272.2022.9853972 (1)
- https://doi.org/10.1111/1365-2664.14175 (1)
- https://doi.org/10.1111/1365-2745.13742 (1)
Number of records 11665, displaying
601 - 625