List of Index: DOI
- https://doi.org/10.1109/TNSE.2021.3052984 (1)
- https://doi.org/10.1109/TPEL.2021.3084918 (1)
- https://doi.org/10.1109/TPEL.2022.3170229 (1)
- https://doi.org/10.1109/TPEL.2022.3179784 (1)
- https://doi.org/10.1109/TPWRD.2021.3071023 (1)
- https://doi.org/10.1109/TPWRD.2022.3179836 (1)
- https://doi.org/10.1109/TPWRS.2022.3228458 (1)
- https://doi.org/10.1109/TSMC.2021.3123136 (1)
- https://doi.org/10.1109/TSP52935.2021.9522602 (1)
- https://doi.org/10.1109/TSP52935.2021.9522616 (1)
- https://doi.org/10.1109/TSP52935.2021.9522676 (1)
- https://doi.org/10.1109/TTE.2022.3189596 (1)
- https://doi.org/10.1109/WCNC55385.2023.10118649 (1)
- https://doi.org/10.1109/VLSI-SoC53125.2021.9606981 (1)
- https://doi.org/10.1109/WPW54272.2022.9853972 (1)
- https://doi.org/10.1111/1365-2664.14175 (1)
- https://doi.org/10.1111/1365-2745.13742 (1)
- https://doi.org/10.1111/1475-4932.12576 (1)
- https://doi.org/10.1111/1541-4337.13103 (1)
- https://doi.org/10.1111/caje.12645 (1)
- https://doi.org/10.1111/ecpo.12235 (1)
- https://doi.org/10.1111/hex.13323 (1)
- https://doi.org/10.1111/jep.13707 (1)
- https://doi.org/10.1111/jvs.13050 (1)
- https://doi.org/10.1111/roiw.12596 (1)
Number of records 12317, displaying
626 - 650