Fatigue performance of semiconductor strain gauges in GFRP laminate
author
Herranen, Henrik
Saar, Tõnis
Gordon, Rauno
Pohlak, Meelis
Lend, Henri
statement of authorship
Henrik Herranen, Tõnis Saar, Rauno Gordon, Meelis Pohlak, Henri Lend
source
Advances in applied materials and electronics engineering III
location of publication
[S.l.]
publisher
Trans Tech Publications
year of publication
2014
pages
p. 244-248
series
Advanced materials research ; 905
conference name, date
3rd International Conference on Applied Materials and Electronics Engineering, AMEE 2014, 26-27 April 2014
conference location
Hong Kong, China
url
https://doi.org/10.4028/www.scientific.net/AMR.905.244
subject term
andurid
pooljuhid
deformatsioon
klaaskiud
laminaat
soojus- ja niiskustehnilised omadused
Scopus
https://www.scopus.com/record/display.uri?eid=2-s2.0-84901716598&origin=inward&txGid=88afa9ac5bad818d45daba18e44faad9
quartile
Q4
keyword
embedded sensor
glass fiber laminate
hygrothermal conditions
silicon strain gauge
ISSN
1022-6680
ISBN
978-303835058-3
notes
Bibliogr.: 14 ref
scientific publication
teaduspublikatsioon
classifier
3.1
TalTech department
masinaehituse instituut
language
inglise