Clamp mode package diffusion welded power SiC Schottky diodes
statement of authorship
O.Korolkov, N.Kuznetsova and T.Rang
location of publication
[Tallinn]
publisher
year of publication
pages
p. 55-58 : ill
ISBN
1-4244-0414-2
notes
Bibliogr.: 5 ref
language
inglise
Korolkov, O., Kuznetsova, N., Rang, T. Clamp mode package diffusion welded power SiC Schottky diodes // BEC 2006 : 2006 International Baltic Electronics Conference : Tallinn University of Technology, October 2-4, 2006, Tallinn, Estonia : proceedings of the 10th Biennial Baltic Electronics Conference. [Tallinn] : Tallinn University of Technology, 2006. p. 55-58 : ill.