Diffusion in the interface region of Ti/TiAl-NB buding
author
statement of authorship
L.Kommel
location of publication
Moscow
year of publication
pages
p. 29
language
inglise
Kommel, L. Diffusion in the interface region of Ti/TiAl-NB buding // Book of abstracts of International Conference on Diffusion in Solids : Past, Present and Future : DiSo-05 : 23-27 May, Moscow, Russia. Moscow, 2005. p. 29.