print

Diffusion in the interface region of Ti/TiAl-NB buding

author
Kommel, Lembit
statement of authorship
L.Kommel
source
Book of abstracts of International Conference on Diffusion in Solids : Past, Present and Future : DiSo-05 : 23-27 May, Moscow, Russia
location of publication
Moscow
year of publication
2005
pages
p. 29
url
https://www.researchgate.net/publication/240837273_Diffusion_in_the_Interface_Region_of_TiTiAl-Nb_Bonding
subject term
titaanisulamid
alumiinium
difusioon (füüsika)
language
inglise
Kommel, L. Diffusion in the interface region of Ti/TiAl-NB buding // Book of abstracts of International Conference on Diffusion in Solids : Past, Present and Future : DiSo-05 : 23-27 May, Moscow, Russia. Moscow, 2005. p. 29. https://www.researchgate.net/publication/240837273_Diffusion_in_the_Interface_Region_of_TiTiAl-Nb_Bonding