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Diffusion in the interface region of Ti/TiAl-NB buding

Kommel, L. Diffusion in the interface region of Ti/TiAl-NB buding // Book of abstracts of International Conference on Diffusion in Solids : Past, Present and Future : DiSo-05 : 23-27 May, Moscow, Russia. Moscow, 2005. p. 29. https://www.researchgate.net/publication/240837273_Diffusion_in_the_Interface_Region_of_TiTiAl-Nb_Bonding