Registri loend: DOI
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- https://doi.org/10.1109/TSP55681.2022.9851384 (1)
- https://doi.org/10.1109/TSTE.2019.2952495 (1)
- https://doi.org/10.1109/TSTE.2023.3237922 (1)
- https://doi.org/10.1109/TTE.2024.3399329 (1)
- https://doi.org/10.1109/TUFFC.2021.3114432 (1)
- https://doi.org/10.1109/TVLSI.2023.3253641 (1)
- https://doi.org/10.1109/TVT.2021.3118392 (1)
- https://doi.org/10.1109/UKRCON.2019.8879877 (1)
- https://doi.org/10.1109/UKRCON.2019.8880002 (1)
- https://doi.org/10.1109/USEC50097.2020.9281165 (1)
- https://doi.org/10.1109/UVS59630.2024.10467174 (1)
- https://doi.org/10.1109/WEMDCD55819.2023.10110903 (1)
- https://doi.org/10.1109/WEMDCD55819.2023.10110940 (1)
- https://doi.org/10.1109/WEMDCD61816.2025.11014141 (1)
- https://doi.org/10.1109/WEMDCD61816.2025.11014207 (1)
- https://doi.org/10.1109/WFCS53837.2022.9779191 (1)
- https://doi.org/10.1109/WF-IoT.2018.8355165 (1)
- https://doi.org/10.1109/WF-IoT51360.2021.9595305 (1)
- https://doi.org/10.1109/VLSID.2015.98 (1)
- https://doi.org/10.1109/VLSI-SoC.2018.8644732 (1)
- https://doi.org/10.1109/WPMC55625.2022.10014802 (1)
- https://doi.org/10.1109/VTC2024-Fall63153.2024.10757897 (1)
- https://doi.org/10.1109/VTC2025-Spring65109.2025.11174582 (1)
- https://doi.org/10.1109/VTC2025-Spring65109.2025.11174864 (1)
Kirjeid leitud 12239, kuvan
7551 - 7575