Thermal behaviour of hydroxymethyl compounds as models for adhesive resins [Electronic resource]
vastutusandmed
Kadri Siimer, Tiit Kaljuvee, Peep Christjanson, Tõnis Pehk, Imre Saks
ilmumiskoht
[Sao Pedro]
ilmumisaasta
leheküljed
p. D-06 [CD-ROM]
märkused
Bibliogr.: 3 ref
keel
inglise
Siimer, K., Kaljuvee, T., Christjanson, P., Pehk, T., Saks, I. Thermal behaviour of hydroxymethyl compounds as models for adhesive resins [Electronic resource] // 14th International Congress on Thermal Analysis and Calorimetry . VI Brazilian Congress on Thermal Analysis and Calorimetry : September 14-18, 2008, Sao Pedro, Brazil. [Sao Pedro], 2008. p. D-06 [CD-ROM].