Embedded electronics influence on the strength of carbon fiber laminate
author
statement of authorship
Hendrik Herranen, Jaan Kers, Jürgo S. Preden, Robert Talalaev, Martin Eerme, Jüri Majak, Henri Lend, Georg Allikas
location of publication
[S.l.]
publisher
year of publication
pages
p. 239-243
conference name, date
3rd International Conference on Applied Materials and Electronics Engineering, AMEE 2014, 26-27 April 2014
conference location
Hong Kong, China
ISSN
1022-6680
ISBN
978-3-03835-058-3
notes
Bibliogr.: 10 ref
scientific publication
teaduspublikatsioon
TalTech department
language
inglise
subject term
keyword
Herranen, H., Kers, J., Preden, J.-S., Talalaev, R., Eerme, M., Majak, J., Lend, H., Allikas, G. Embedded electronics influence on the strength of carbon fiber laminate // Advances in applied materials and electronics engineering III. [S.l.] : Trans Tech Publications, 2014. p. 239-243. (Advanced materials research ; 905). https://doi.org/10.4028/www.scientific.net/AMR.905.239