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copper diffusion (võtmesõna)
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Copper, Paul
autor
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artikkel ajakirjas
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artikkel kogumikus
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dissertatsioon
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Bibliokirje
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ilmumisaasta kasvavalt
ilmumisaasta kahanevalt
pealkiri kasvavalt
pealkiri kahanevalt
1
artikkel ajakirjas
Ageing of kesterite solar cells 1 : Degradation processes and their influence on solar cell parameters
Neubauer, Christian
;
Samieipour, Ali
;
Oueslati, Souhaib
;
Danilson, Mati
;
Meissner, Dieter
Thin solid films
2019
/
p. 595-599 : ill
https://doi.org/10.1016/j.tsf.2018.11.043
artikkel ajakirjas
2
artikkel ajakirjas
Ageing of kesterite solar cells 2 : Impact on photocurrent generation
Samieipour, Ali
;
Neubauer, Christian
;
Oueslati, Souhaib
;
Mikli, Valdek
;
Meissner, Dieter
Thin solid films
2019
/
p. 509-513 : ill
https://doi.org/10.1016/j.tsf.2018.11.044
artikkel ajakirjas
Kirjeid leitud 2, kuvan
1 - 2
pealkiri
185
1.
Exposure of freshwater zooplankton to copper nanoparticles : toxicity and copper body burden
2.
SHS reprocessing of copper oxide waste into copper powder
3.
Copper chaperones. The concept of conformational control in the metabolism of copper
4.
Shifting constellations of actors and their influence on policy diffusion : a study of the diffusion of drug courts
5.
The native copper- and zinc- binding protein metallothionein blocks copper-mediated A[beeta] aggregation and toxicity in rat cortical neurons
6.
A theoretically accurate mobility model for drift-diffusion power device simulation
7.
A theoretically accurate mobility model for semiconductor device drift-diffusion simulation
8.
A thermoanalytical and structural study of copper(I) thiocarbamide compounds
9.
A thermoanalytical study of copper(I) thiocarbamide compounds
10.
Affinity gradients drive copper to cellular destinations
11.
Affinity of zinc and copper ions for insulin monomers
12.
AFM characterization of the surface morphology of the severe plastic deformed copper [Electronic resource]
13.
Ambipolar diffusion in a three-carrier semiconductor plasma
14.
An experimental study of diffusion welded contacts to p-type silicon carbide
15.
Analysis of molecular movement reveals latticelike obstructions to diffusion in heart muscle cells
16.
Apparent decrease of diffusion coefficients due to the plasma-induced band gap narrowing
17.
Binding of zinc(II) and copper(II) to the full-length Alzheimer's amyloid-[beeta] peptide
18.
Boundary control for a class of coupled fractional reaction-diffusion systems
19.
Brazing and diffusion welding of tungsten free hardmetals
20.
Brazing and diffusion welding of tungsten free hardmetals [Electronic resource]
21.
Ceneral discussion on the subject "Mictroturbulent diffusion and dispersion"
22.
Challenging diffusion of digital receipts
23.
Chemical diffusion in undoped ZnS and undoped CdSe
24.
Chemical incorporation of copper into indium selenide thin films
25.
Chemical incorporation of copper into indium selenide thin-films for processing of CuInSe2 solar cells
26.
Chemical interaction of copper sulfate with calcium dihydrophosphate
27.
Chemical self-diffusion in undoped ZnS and in undoped CdSe
28.
Cities & international policy diffusion : the case of Tokyo
29.
Clamp mode package diffusion welded power SiC Schottky diodes
30.
Comparative characteristics of 6H- and 4H-SiC surfaces in diffusion welding
31.
Comparative characteristics of diffusion welded Al contacts to 6H- and 4H-SiC substrates
32.
Comparative characteristics of diffusion-welded high-voltage stacks and connected in series Schottky diodes
33.
Comparison of individual SiC JBS chips and JBS stacks connected in series by diffusion welding
34.
Comparison of Schottky parameters for diffusion-welded and sputter contacts to silicon carbide
35.
Compound carbide composites produced by diffusion bonding
36.
Computational study of copper-catalyzed alkyne-azide cycloaddition reaction
37.
Copper chalcopyrites for solar energy applications
38.
Copper indium disulfide films by chemical spray pyrolysis for photovoltaics
39.
Copper sulfides by chemical spray pyrolysis process
40.
Copper(I)-binding properties of de-coppering drugs for treatment of Wilson disease
41.
Copper(II) ions and the Alzheimer's amyloid-β peptide : affinity and stoichiometry of binding
42.
Copper(II)-binding equilibria in human blood
43.
Copper–zinc oxide heterojunction catalysts exhibiting enhanced photocatalytic activity prepared by a hybrid deposition method
44.
CTA diffusion based recursive energy detection
45.
Damage evolution of structure and fracture of nanocrystalline copper at cyclic deformation
46.
Deposition of copper indium disulphide films by chemical spray pyrolysis
47.
Determination of copper in biological samples by inductivelycoupled plasma (ICP)
48.
Determination of time-dependent sources and parameters of nonlocal diffusion and wave equations from final data
49.
Determining the embedding parameters governing long-term dynamics of copper prices
50.
Diffusion acoustique d'un moyeu et d'une pale
51.
Diffusion and phase transformation in SC superalloys aided by HCV deformation
52.
Diffusion and phase transformation influences on life extension of superalloys
53.
Diffusion bonding hardmetals with steels
54.
Diffusion bonding of steels with ceramic and metal composites
55.
Diffusion in SC Ni-base superalloy under viscoplastic deformation
56.
Diffusion in SC Ni-base superalloys under viscoplastic deformation
57.
Diffusion in the interface region of Ti/TiAl-Nb bonding
58.
Diffusion in the interface region of Ti/TiAl-NB buding
59.
Diffusion of oriented particles in porous media
60.
Diffusion welded Al contacts to p-type SiC
61.
Diffusion welded contacts and related art applied to semiconductor materials
62.
Diffusion welded contacts for silicon semiconductor devices
63.
Diffusion welding and brazing of tungsten free hardmetals
64.
Diffusion welding as an alternative for joining cermets (hardmetals) and steels
65.
Diffusion welding contacts to 6H-SiC substrates
66.
Diffusion welding techniques for power SiC Schottky packaging
67.
Diffusion welding technology as a method of metallization of ceramic substrates
68.
Diffusion welding technology for 6H-SiC substrates
69.
Diffusion welding technology for wide bandgap materials
70.
Diffusionsschweissen von Werkstoffen mit unterschiedlichen Eigenschaften = Diffusion welding of different materials = Erinevate materjalide difusioonkeevitus
71.
Discussion on the subject "Microturbulent diffusion and dispersion"
72.
Distributed diffusion LMS based energy detection
73.
Distributed largest eigenvalue-based spectrum sensing using diffusion LMS
74.
Dual compounds "cemented carbide+steel" produced by diffusion bonding
75.
Effect of hard cyclic viscoplastic deformation on hardening/softening of SPD-copper
76.
Electrochemical etching of copper indium diselenide surface
77.
Electrodeposition of adherent copper film on unmodified tungsten
78.
Electron microscopy study of contact layers in n-type 4H-SiC after diffusion welding
79.
Estimation of diffusion restrictions in cardiomyocytes using kinetic measurements = Difusioonitakistuste hindamine kardiomüotsüütides kasutades kineetilisi mõõtmisi
80.
Experimental study of surface distortions in silicon carbide caused by diffusion welding
81.
Fabrication of localized diamond-filled copper structures via selective laser melting and spark plasma sintering
82.
Fabrication, control and properties of nanocrystalline copper
83.
Facile synthesis of distally fluorinated ketones by copper-mediated oxidative ring cleavage of cyclopropanols
84.
Flexible solar cells based on copper tape : hybrid organic-inorganic structures
85.
Formation of copper zinc tin sulfide in cadmium iodide for monograin membrane solar cells
86.
Formation of Diffusion welded Al contacts to semiconductor silicon carbide
87.
Functional characterization of the cellular copper proteome = Rakulise vase proteoomi funtsionaalne iseloomustamine
88.
GaAs based diffusion welded high voltage diode stacks [Electronic resource]
89.
Gas-phase photocatalytic activity of nanostructured titanium dioxide from diffusion flame synthesis
90.
Heterogeneity of diffusion restrictions in cardiomyocytes = Difusioonitakistuste heterogeensus südamelihasrakkudes
91.
High quality metal ceramic interfaces using diffusion welding technology
92.
High temperature diffusion of halogens and alkali metals into polyparaphenylene
93.
High temperature diffusion of halogens in polyparaphenylene
94.
High voltage diffusion‐welded stacks on the basis of SiC Schottky diodes
95.
High-temperature conductivity of undoped and copper-doped cadmium selenide
96.
High-voltage diffusion‐welded stacks on the basis of SiC Schottky diodes
97.
Homogeneous deposition of copper oxide on mesoporous 1D alumina nanofibres by combustion approach
98.
Human superoxide dismutase 1 (hSOD1) maturation through interaction with human copper chaperone for SOD1 (hCCS)
99.
Hybrid copper-indium disulfide polypyrrole/photovoltaic structures prepared by electrodeposition
100.
Influence of copper and oxygen on the optoelectronic properties of chlorine doped CdTe fhin films
101.
Influence of copper and oxygen on the optoelectronic properties of chlorine doped CdTe thin films
102.
Influence of excitonic scattering on charge carrier ambipolar diffusion in silicon
103.
Influence of SPD on structure and properties of copper
104.
Influence of the copper content on the optical properties of CZTSe thin films
105.
Intermediate compounds in formation of copper sulfides by spray pyrolysis
106.
Internal stresses in diffusion bonded joints
107.
International diffusion of software technology and information systems : a comparative analysis [Electronic resource]
108.
Interpretation of some physical parameters of SiC Schottky interfaces manufactured by diffusion welding technology
109.
Intracellular diffusion of adenosine phosphates is locally restricted in cardiac muscle
110.
Inverse problem to determine order of derivative and kernel in generalized time fractional diffusion equation
111.
Inverse problems for a perturbed time fractional diffusion equation with final overdetermination
112.
Inverse source problem with a posteriori boundary measurement for fractional diffusion equations
113.
Investigation of additional states in the silicon carbide surface after diffusion welding
114.
Investigation of nickel and copper microfoils defect formation under the stress
115.
Investigation of subcontact layers in SiC after diffusion welding
116.
Investigation of the combined stress and strain situation in diffusion welded rectifying elements
117.
Mammalian copper chaperone Cox17 exist in two metalloforms linked by oxydative switch
118.
Mechanical behaviour of nanostructured copper produced by SPD method
119.
Metal-binding mechanism of Cox17, a copper chaperone for cytochrome c oxidase
120.
Microscopic characterization of surface morphology of nanostructured copper
121.
Microscopic stady of structural features of nanocrystalline copper [Electronic resource]
122.
Microstructural evolution and mechanical properties of nanostructured copper
123.
Microstructural features of ultrafine grained copper under severe deformation
124.
Microstructure and microhardness characteristics in the interface region of Ti/TiAl-Nb diffusion bonding
125.
Microstructure and properties development of copper during severe plastic deformation
126.
Microstructure and properties development of copper during severe plastic deformation [Electronic resource]
127.
Microstructure, texture and mechanical properties of cyclic expansion-extrusion deformed pure copper
128.
Mitochondrial copper(I) transfer from Cox17 to Sco1 is coupled to electron transfer
129.
Multicomponent diffusion in purification by cristallization
130.
Nanosructured copper manufacturing features and mechanical/physical properties forming
131.
New product diffusion in the Baltic States
132.
Non-diffusion of management innovation: the case of lean [Electronic resource]
133.
Number of open mitochondrial voltage-dependent anion channels and intracellular diffusion coefficient in heart muscle
134.
Observation and stabilisation of coupled time‐fractional reaction–advection–diffusion systems with spatially‐varying coefficients
135.
Optoelectronic surface emitters of terahertz radiation from copper chalcogenides
136.
Oxidative switches in functioning of mammalian copper chaperone Cox17
137.
Policy diffusion at the local level : participatory budgeting in Estonia
138.
Preliminary investigation of diffusion welded contacts to p-type 6H-SiC
139.
Principles to analyse the moisture performance of timber-framed external wall assembly due to diffusion
140.
Properties development of ultrafine-grained copper under hard cyclic viscoplastic deformation
141.
Properties of CuInS2 thin films prepared by spray pyrolysis from copper rich solution
142.
Rapid in situ assessment of Cu-ion mediated effects and antibacterial efficacy of copper surfaces
143.
Reliability of dual compounds “carbide composite+steel” produced by diffusion welding
144.
SiC JBS diode symmetrical voltage doubler represented as the diffusion-welded stack
145.
SIC schottky diode rectifier bridge represented as the diffusion-welded stack
146.
Simple access to β-trifluoromethyl-substituted ketones via copper-catalyzed ring-opening trifluoromethylation of substituted cyclopropanols
147.
Solar cells based on polycrystalline copper-indium chalcogenides and conductive polymers
148.
Some comparative properties of diffusion-welded contacts to 6H and 4H silicon carbide
149.
Some of comparative properties of diffusion welded contacts to 6H- and 4H-silicon carbide
150.
Stability and damage of nanocrystalline copper at cyclic elastic-plastic deformation
151.
Strength and plasticity of nanocrystalline copper
152.
Strength and plasticity of nanocrystalline copper after HCV deformation
153.
Structural and functional insight into trafficking of copper in the cell
154.
Structural behavior and damage evolution of nanocrystalline copper at HCV deformation
155.
Structural behaviour of NC copper at hard cyclic viscoplastic deformation
156.
Structure and functioning of copper chaperones
157.
Structure evolution of submicrocrystalline copper during cyclic deformation
158.
Study of the ultrafine-grains intrinsic nanostructure refinement by severe plastic deformation of copper alloys
159.
Surface analysis of spray deposited copper indium disulfide films
160.
Synthesis of γ-keto sulfones by copper-catalyzed oxidative sulfonylation of tertiary cyclopropanols
161.
Synthesis, vibrational spectra and X-ray structures of copper(I) thiourea complexes
162.
The basic parameters of diffusion welded Al Schottky contacts to p- and n-SiC
163.
The basic Schottky parameters for combined diffusion welded and sputter metal contacts
164.
The copper structure and properties evolution in zone of severe plastic deformation
165.
The diffusion welded contacts in power electronics
166.
The diffusion welded contacts in power electronics and electrotechnics
167.
The effect of HCV deformation on hardening/softening of SPD copper
168.
The measurement and tuning of SiC diode voltage doubler represented as diffusion-welded stack [Online resource]
169.
The probabilistic characteristics of pollutants diffusion in marine environment
170.
The Schottky parameter test for combined diffusion welded and sputter large area contacts
171.
The template-assisted wet-combustion synthesis of copper oxide nanoparticles on mesoporous network of alumina nanofibers
172.
Theorem for the limit behavior of the solutions of the diffusion type stochastic differential equation
173.
Thermal decomposition of cadmium and copper thiocarbamide chlorides
174.
Thermal decomposition of cadmium, zinc and copper thiocarbamide chlorides
175.
Thermal decomposition of copper(I) thiocarbamide chloride hemihydrate
176.
TiC-base cermet steel dual compounds produced by diffusion bonding
177.
Tribological characteristics of copper based composites with Al2O3 particles at various temperatures
178.
Tribological characteristics of nanostructured copper
179.
Tribological parameters of copper-alumina composite
180.
2001. International diffusion of high technology : an IT supported training approach [Electronic resource]
181.
2001. Software engineering methods, techniques and tools : their international diffusion [Electronic resource]
182.
Uniqueness for an inverse problem for a semilinear time-fractional diffusion equation
183.
Wear behavior of ceramic-metal composites as tool material for FSW of copper
184.
Viscoplastic behavior of SPD copper
185.
X-ray photoelectron spectroscopy of spray pyrolysis deposited copper indium disulfide films
võtmesõna
76
1.
copper diffusion
2.
ADP diffusion restriction
3.
Al diffusion
4.
anomalous diffusion
5.
copper
6.
copper alloy
7.
copper alloys
8.
copper aluminate
9.
Copper antimony selenide
10.
copper cadmium germanium selenide
11.
copper chaperones
12.
Copper germanium sulfoselenide
13.
copper indium disulfide
14.
copper indium disulphide
15.
Copper indium gallium selenide
16.
Copper indium selenide
17.
copper metabolism
18.
copper modified hydroxyapatite
19.
copper oily waste
20.
copper oxide
21.
copper oxide nanoparticles
22.
copper oxides
23.
copper prices
24.
copper sulfides
25.
copper zinc tin selenide
26.
copper zinc tin sulfide
27.
copper zinc tin sulfur selenide
28.
copper zinc tin sulphide
29.
copper transport
30.
copper(I) chloride
31.
copper(II) paratungstate B
32.
copper(II)ion
33.
copper-based wood preservatives
34.
copper-binding motifs
35.
copper-zinc-tin-sulfide (CZTS)
36.
copper-thiolate clusters
37.
copper-tungsten composite
38.
coupled time fractional order reaction–advection–diffusion systems
39.
deformation-enhanced diffusion
40.
diffusion
41.
diffusion of knowledge
42.
diffusion (mass transfer, heat transfer)
43.
diffusion and self-trapping of charge carriers
44.
diffusion bonding
45.
diffusion in solids
46.
diffusion LMS
47.
diffusion networks
48.
diffusion of international planning
49.
diffusion of ivoting
50.
diffusion of knowledge
51.
diffusion processes
52.
diffusion strategy
53.
diffusion welded stacks
54.
diffusion welding
55.
diffusion-controlled wear
56.
fractional diffusion
57.
fractional diffusion-wave equation
58.
hydrogel oxygen diffusion
59.
innovation diffusion
60.
innovation diffusion and innovation adaption
61.
interface diffusion
62.
intracellular diffusion barriers
63.
intracellular diffusion obstacles
64.
knowledge diffusion
65.
nonlocal diffusion and wave equations
66.
permuation-diffusion
67.
PM copper alloys
68.
policy diffusion
69.
reaction-diffusion systems
70.
Smagorinsky diffusion
71.
solid state diffusion
72.
technology transfer and diffusion
73.
tungsten-copper nanocomposite
74.
wafer bonding/diffusion welding
75.
water vapour diffusion equivalent thickness
76.
1D drift-diffusion simulations
allikas
5
1.
56th Rocky Mountain Conference on Magnetic Resonance : July 13-17, 2014, Copper Conference Center, Copper Mountain, Colorado, USA
2.
Copper zinc tin sulfide-based thin film solar cells
3.
Defect and diffusion forum
4.
Defects and diffusion forum
5.
Diffusion in Solids and Liquids V
autor
1
1.
Copper, Paul
seeria-sari
1
1.
Defect and Diffusion Forum ; vol 297-301
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